What happened: ground-breaking for an OSAT facility in Visakhapatnam (1 August 2026)
A ground-breaking ceremony for an Advanced System in Package Technologies (OSAT) facility was held in Visakhapatnam, Andhra Pradesh on 1 August 2026. Prime Minister Narendra Modi attended the ceremony.
The OSAT facility project is attributed to ASiP Technologies. The ceremony listing also references partner/mission branding elements connected with the India Semiconductor Mission ecosystem.
Named officials attending included Ashwini Vaishnaw and Nara Chandrababu Naidu.
What the OSAT facility is described to cover (capacity, workforce, ecosystem)
The OSAT facility is described as supporting advanced semiconductor packaging for semiconductor and AI data-centre use-cases and high-speed applications. The project description also states plans for production scale-up, workforce and capability development, and expansion of advanced packaging capacity.
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